成熟的MMPA+TxM架构,支持多种模式多个频率的通信需求。可通过更换相同封装的物料实现功率、支持频段数目的调整。不同的天线开关架构,可实现多种载波聚合组合。频段选择开关支持多种架构,方便客户实现多种规格的智能手机射频前端设计。
GROUP | Part | Function | Package |
4G MMMB PA | OM8443-22 | Phase II, HB/MB/LB, 4HB/5MB/5LB | LGA 4.0 x 6.8 x 0.83 mm |
4G MMMB PA | OM9902-31H | Phase II, HB/MB/LB, 4HB/5MB/5LB, 3.4V HPUE | LGA 4.0 x 6.8 x 0.83 mm |
4G MMMB PA | Phase II, HB/MB/LB, 4HB/5MB/5LB | LGA 4.0 x 6.8 x 0.72 mm | |
4G MMMB PA | Phase II, HB/MB/LB, 4HB/5MB/5LB | LGA 4.0 x 6.8 x 0.83 mm | |
4G TXM CMOS | OM8828-21 | Quad-Band GSM / GPRS / EDGE, 16 TRx Switch, Dual-Band TD-SCDMA, TDD LTE Band 39, Two Antenna Ports | LGA 5.5 x 5.5 x 0.78 mm |
4G TXM CMOS | OM8820-21 | Quad-Band GSM / GPRS / EDGE, 15 TRx Switch, Dual-Band TD-SCDMA, TDD LTE Band 39 | LGA 5.5 x 5.5 x 0.78 mm |
4G TXM | QUAD-BAND GSM/GPRS/EDGE,14TRx Switch,TDD-LTE | LGA 5.5 x 5.3 x 0.74 mm | |
Band Switch | SPDT Switch, GPIO | DFN 1.1 mm x 0.7 mm x 0.38 mm | |
Band Switch | SP8T Switch, GPIO | QFN 2.0 mm x 2.0 mm x 0.55 mm | |
Band Switch | SP6T Switch, MIPI | LGA 2.0 mm x 2.0 mm x 0.75 mm | |
Band Switch | SP8T Switch, MIPI | LGA 2.0 mm x 2.0 mm x 0.75 mm | |
Band Switch | SP10T Switch, MIPI | LGA 2.4 mm x 2.4 mm x 0.58 mm | |
Band Switch | SP12T Switch, MIPI | LGA 2.5 mm x 2.5 mm x 0.75 mm | |
Band Switch | DP12T Switch, MIPI | LGA 2.4 mm x 2.0 mm x 0.58 mm | |
WIFI Band Switch | SPDT Switch, GPIO | LGA 1.1 mm x 1.1 mm x 0.4 mm |
产品优势:
1) 支持多模多频工作模式
2) 支持0.7-2.7GHz宽频工作
3) 支持APT优化效率及功耗
4) 高功率,高效率,低谐波干扰
5) 单刀/双刀多掷开关,结构灵活